Tintronics used an automated/robotic hot solder dip station to apply a hot solder tinning dip to a QFN chip, which is used in a military radio frequency application for the defense industry. The company used Sn63 Pb37 solder and ORH1 flux and ground the plane co-planarity down to .002”. Inspection/lead scanning as well as visual and final inspections were also completed. The application meets the defense customer’s specifications, as well as ANSI/ESD S20.20 IPC J-STD-001 and IPC/JEDEC J-STD-033 standards on the low-volume production runs.